Pentium Dual-Core Processor G6405 4.10 GHz 4MB Cache

Introduction

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Identity Protection Technology

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Processor

Processor manufacturer

Intel

Processor model

G6405

Processor base frequency

4.1 GHz

Processor family

Intel® Pentium® Gold

Processor cores

2

Processor socket

LGA 1200 (Socket H5)

Component for

PC

Processor lithography

14 nm

Processor threads

4

System bus rate

8 GT/s

Processor operating modes

64-bit

Processor cache

4 MB

Processor cache type

Smart Cache

Thermal Design Power (TDP)

58 W

Box

Y

Memory bandwidth supported by processor (max)

41.6 GB/s

Processor codename

Comet Lake

Processor ARK ID

201901

Memory

Maximum internal memory supported by processor

128 GB

Memory types supported by processor

DDR4-SDRAM

Memory clock speeds supported by processor

2666 MHz

Memory channels

Dual-channel

Memory bandwidth (max)

41.6 GB/s

Graphics

On-board graphics card

Y

Discrete graphics card

N

On-board graphics card model

Intel® UHD Graphics 610

Maximum on-board graphics card memory

64 GB

On-board graphics card base frequency

350 MHz

On-board graphics card dynamic frequency (max)

1050 MHz

Number of displays supported (on-board graphics)

3

On-board graphics card 4K support

Y

On-board graphics card DirectX version

12.0

On-board graphics card OpenGL version

4.5

On-board graphics card maximum resolution (DisplayPort)

4096 x 2304 pixels

On-board graphics card maximum resolution (eDP - Integrated Flat Panel)

4096 x 2304 pixels

On-board graphics card maximum resolution (HDMI)

4096 x 2160 pixels

On-board graphics card refresh rate at maximum resolution (DisplayPort)

60 Hz

On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel)

60 Hz

On-board graphics card refresh rate at maximum resolution (HDMI)

30 Hz

On-board graphics card ID

0x9BA8

Discrete graphics card model

Not available

Features

Execute Disable Bit

Y

Idle States

Y

Thermal Monitoring Technologies

Y

Market segment

Desktop

Use conditions

PC/Client/Tablet

Maximum number of PCI Express lanes

16

PCI Express slots version

3.0

PCI Express configurations

1x16,2x8,1x8+2x4

Supported instruction sets

SSE4.1,SSE4.2

Scalability

1S

CPU configuration (max)

1

Embedded options available

N

Thermal solution specification

PCG 2015C

Harmonized System (HS) code

8542310001

Export Control Classification Number (ECCN)

5A992C

Commodity Classification Automated Tracking System (CCATS)

G077159

Processor special features

Intel® Hyper Threading Technology (Intel® HT Technology)

Y

Intel® Identity Protection Technology (Intel® IPT)

Y

Intel® Turbo Boost Technology

N

Intel® Quick Sync Video Technology

Y

Intel® InTru™ 3D Technology

Y

Intel® Clear Video HD Technology (Intel® CVT HD)

Y

Intel® AES New Instructions (Intel® AES-NI)

Y

Enhanced Intel SpeedStep Technology

Y

Intel Trusted Execution Technology

N

Intel® Thermal Velocity Boost

N

Intel® Transactional Synchronization Extensions

N

Intel VT-x with Extended Page Tables (EPT)

Y

Intel® Secure Key

Y

Intel Stable Image Platform Program (SIPP)

N

Intel® OS Guard

Y

Intel Clear Video Technology

Y

Intel Software Guard Extensions (Intel SGX)

Y

Intel 64

Y

Intel Virtualization Technology (VT-x)

Y

Intel Virtualization Technology for Directed I/O (VT-d)

Y

Intel Turbo Boost Max Technology 3.0

N

Intel® Optane™ Memory Ready

Y

Intel® Boot Guard

Y

Intel® vPro™ Platform Eligibility

N

Operational conditions

Tjunction

100 °C

Technical details

Launch date

Q1'21

Status

Launched

Supported memory types

DDR4-SDRAM

Packaging data

Package type

Retail box

Weight & dimensions

Processor package size

37.5 x 37.5 mm

Other features

Maximum internal memory

128 GB